Products
Press Release Distribution
Press Release Optimizer
Media Suite
Media Database
Media Pitching
Media Monitoring
Analytics
Media Room
Pricing
Customer Stories
Resources
Education
Blog
PR & Earned Media Planner
For Journalists
RSS Feeds
Support
Newsroom
Log In
Sign Up
All Categories
Business
Entertainment
Health
Finance
Other
Tagged
bga-devices
Press Release
Aug 3, 2010
New Fine Pitch Bump Adapters from Aries Allow BGA Devices of Any Pitch to be Used with 0.40 mm Pitch Boards
New Adapters Save Rework Costs by Enabling Use of Higher Pitch Devices on Smaller Pitch Boards
Read Press Release
First
Prev
1
Next
Last