Lucintel Anticipates the Global Adhesive Pastes and Films Market in Semiconductor Packaging Industry to Grow
Adhesive pastes and films are used for three basic applications in semiconductor devices: dicing, back-grinding, and die-attachment.
Worldwide, November 27, 2014 (Newswire.com) - Adhesive pastes and films are used for three basic applications in semiconductor devices: dicing, back-grinding, and die-attachment. The Asia Pacific region is expected to be the largest region of the global adhesive pastes and films market in the semiconductor packaging industry by 2017. Integrated circuits are becoming thinner and sleeker. Thinner devices are now manufactured for enhancing device performance and in turn, increase the demand for adhesive pastes and films. This encourages the manufacturers to develop new materials and design sleeker adhesion lines.
The global adhesive pastes and films market in the semiconductor packaging industry is expected to grow at a CAGR of 5.9% during 2012-2017. In terms of market segments, adhesive film will be the major segment. Henkel, Hitachi Chemical, AIT, and Sumitomo Bakelite are some of the manufacturers for various applications in the global adhesive pastes and films market in the semiconductor packaging industry.
Lucintel, a leading global management consulting and market research firm, has analyzed the consumption of adhesive pastes and films in the semiconductor packaging industry and has come up with a comprehensive report, “Global Adhesive Pastes and Films Market in Semiconductor Packaging Industry 2012-2017: Trends, Forecast, and Opportunity Analysis.” This study provides a concise overview of the global adhesive pastes and films market in terms of value and opportunities for growth. The study also includes forecasts for the global adhesive pastes and films market in the semiconductor packaging industry through 2017 segmented by regions, applications, and raw material types as follows:
The global adhesive pastes and films market in the semiconductor packaging industry segmented by regions:
{C}· North America
{C}· Europe
{C}· APAC
{C}· ROW
The global adhesive pastes and films market in the semiconductor packaging industry segmented by applications for the above regions:
{C}· Dicing
{C}· Back-Grinding
{C}· Die-Attachment
The global adhesive pastes and films market in the semiconductor packaging industry segmented by raw material types:
{C}· Epoxy
{C}· Silicone
{C}· Polymide
{C}· Acrylic Resins
This 107-pages research report will enable you to make confident business decisions in the global adhesive pastes and films market in the semiconductor packaging industry. For a detailed table of contents and pricing information on this timely, insightful report, click on this link http://www.lucintel.com/reports/chemical_composites/global_adhesive_paste_and_film_market_in_semiconductor_packaging_industry_2012-2017_trends_forecast_and_opportunity_analysis_february_2013.aspx or contact Lucintel at +1-972-636-5056 or via email at helpdesk@lucintel.com. Lucintel offerings include Chemical Market Research Reports, Chemical Industry Analysis Report, Opportunity Screening and Analysis, Capital Investment Feasibility and SWOT Matrix.
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