CyberOptics Semiconductor to Demo Final Production Version of WaferSense® Airborne Particle Sensor at Semicon Japan

Wilsonville, OR (I-Newswire) November 27, 2011 - CyberOptics Semiconductors (www.cyberopticssemi.com) will demonstrate the final production version of the WaferSense® Airborne Particle Sensor (APS) during Semicon Japan in booth number 5B-204. The company will also feature its full line of WaferSense wireless metrology devices at the international trade show scheduled for December 5 – 7, 2011 at the Makuhari Messe in Chiba, Japan.

Addressing the limitations of traditional airborne particle with limited reach and static output, the WaferSense APS travels through the entire semiconductor process, counting particles to identify when and where particles are occurring in real time. By reducing the time and expense associated with process equipment particle qualification, the APS improves die yield and compress final wafer inspection.

Fabs unable to isolate and mitigate the source of particles in a tool before wafer processing can use this sensor to efficiently detect and classify particles with their exact sources as wafers are transferred, slit valves actuate and chambers are cycled, pumped down and purged. With real-time views of particle conditions, process engineers can address specific trouble spots and be better prepared to pass particle qualifications on the very first attempt.

The APS is available in 200 mm, 300 mm (and 450mm special order) wafer-like form factors. For more information on the Airborne Particle Sensor, please refer to our web site at http://www.cyberopticssemi.com/products/wafersense/aps/ or contact sales at CSsales@cyberoptics.com. You can also visit the company’s Japanese language site at http://jp.cyberopticssemi.com/.

About CyberOptics Semiconductor, Inc.
CyberOptics Semiconductor develops automated products that seamlessly measure critical parameters in semiconductor fabrication processes and equipment. The company’s pioneering WaferSense® line includes wireless metrology devices for vibration, leveling, gapping, teaching and sensing airborne particles in semiconductor process equipment. The company is the largest producer of reflective wafermapping sensors and a leading provider of frame grabber machine vision boards under its HAMA Sensors™ and Imagenation™ brands. CyberOptics Semiconductor is a subsidiary of CyberOptics Corp. (Nasdaq:CYBE), one of the world's leading providers of process yield and throughput improvement solutions for the electronic assembly and semiconductor fabrication industries. For information, visit http://www.cyberopticssemi.com/, e-mail CSsales@cyberoptics.com or call 800-366-9131.


Contacts:
CyberOptics Semiconductor, Inc.
Lindsey Dietz
503.495.2217
ldietz[at]cyberoptics.com
http://www.cyberopticssemi.com/

About CyberOptics Semiconductor:
CyberOptics Semiconductor develops automated products that seamlessly measure critical parameters in semiconductor fabrication processes and equipment. The company’s pioneering WaferSense® line includes wireless metrology devices for vibration, leveling, gapping, teaching and sensing airborne particles in semiconductor process equipment. The company is the largest producer of reflective wafermapping sensors and a leading provider of frame grabber machine vision boards under its HAMA Sensors™ and Imagenation™ brands. CyberOptics Semiconductor is a subsidiary of CyberOptics Corp. (Nasdaq:CYBE), one of the world's leading providers of process yield and throughput improvement solutions for the electronic assembly and semiconductor fabrication industries. For information, visit http://www.cyberopticssemi.com/, e-mail CSsales@cyberoptics.com or call 800-366-9131.

Company Contact Information
CyberOptics Semiconductor
Lindsey Dietz
9130 SW Pioneer Court, Suite D
97070
Phone : 800-366-9131