ATS’ SuperGRIP Holds Strong On Sitara ARM Microprocessors

Advanced Thermal Solutions, Inc., (ATS), has introduced a line of heat sinks compatible with the Sitara ARM Microprocessor family from Texas Instruments. ATS’ patented maxiFLOW™ heat sinks with superGRIP™ clip attachment ensure maximum performa

Norwood, MA (I-Newswire) February 22, 2013 - Advanced Thermal Solutions, Inc., (ATS), has introduced a line of heat sinks compatible with the Sitara ARM Microprocessor family from Texas Instruments. The Sitara ARM Microprocessors feature ARM Cortex-8 and ARM9 MPUs, which are used in a wide variety of Industrial, Medical, and Consumer Electronics applications. The AM17x family consists of low-power ARM microprocessors that enable OEMs and ODMs to maximize product offerings by providing high processing performance life, advanced operating systems and rich user interfaces. Compatible operating systems include Neutrino, Integrity, Windows, Embedded CE, Linux, VXWorks and Android.

ATS’ patented maxiFLOW™ heat sinks with superGRIP™ clip attachment ensure long-term product reliability and maximum performance from the Sitara ARM Microprocessors. maxiFLOW™ high performance BGA heat sinks feature a low profile, spread fin array that maximizes surface area for more effective convection air cooling. The unique maxiFLOW™ design provides thermal performance that is 30–200% better than conventional heat sinks. maxiFLOW™ is available with pre-assembled phase change material, maxiGRIP™ clip attachments, and superGRIP™ clip attachments.

The superGRIP™ attachment system features a plastic frame clip that fastens securely around the perimeter of a component and a metal spring clip that slips through a heat sink’s fin field and locks securely to both ends of the plastic frame. The resulting superGRIP™ assembly applies steady even pressure to the component throughout the product lifecycle, improving thermal performance and long-term reliability. ATS’ superGRIP™ heat sink attachment system permits the use of high performance phase changing thermal interface materials that improves heat transfer by as much as 20 times more than typical double-sided adhesive thermal tapes. It also allows for the heat sink to be detached and reattached without damaging the component or the PCB, an important feature for applications where PCB rework and ease of assembly and disassembly are important. The full range of ATS products compatible with Texas Instruments products can be viewed in the new heat sink selection tool on http://qats.com/Distributor/AE-Dist.php

To learn more about maxiFLOWâ„¢ heat sinks and the superGRIPâ„¢ clip attachment, please visit www.qats.com, email ats-hq@qats.com, or call 781-769-2800.